2012/ 10 /29 ver.2 page 1 sp e6 v8ud ultra low capacitance 4 -line esd protection array description applications the spe6v8ud is 4- channel very low capacitance esd transient voltage suppressor which provides a very high level of protection for sensitive electro nic components that may be subjected to electrostatic discharge. it is particularly well- suited to protect systems with high speed communication lines from esd, eft, and lighting. the spe6v8ud is consists of eight low capacitance steering diodes and a tvs diode in a slp package. each channel of spe6v8ud could safely dissipate esd strik es of 15kv air discharge as well as 8kv contact discharge, meeting the requirement of the iec 61000-4- 2 international standard. using the mil-std- 883 (method 3015) specification for human body model (hbm) esd, the device provides protection for contact d ischarges to greater than 15kv. cellular handsets and accessories cordless phone pda notebooks and handhelds portable instrumentation digital cameras mp3 player high definition multi-media interface protection usb 2.0 power and data line monitors and notebook computers hdsl, idsl secondary ic side protection 10/100/1000 ethernet features pin configuration ( dfn-10 ) transient protection for data lines to iec 61000-4-2 (esd) 15kv (air) 8kv (contact) iec 61000-4-4 (eft) 40a (5/50ns) protects five bidirectional i/o lines working voltage: 5v low leakage current low operating and clamping voltages low capacitance: 0.35 pf typical ( length = 2.5mm ) part marking
2012/ 10 /29 ver.2 page 2 sp e6 v8ud ultra low capacitance 4 -line esd protection array ordering information part number package part marking SPE6V8UDFN10RGB dfn-10 wyw yw = date code ( y : 0~9 , w : a~z and a~z) SPE6V8UDFN10RGB : tape reel ; pb C free ; halogen C free absoulte maximum ratings (t a =25 unless otherwise noted) parameter symbol typical unit peak pulse power ( tp = 8/20 s ) ppk 180 w maximum peak pulse current ( tp = 8/20 s ) ipp 7 a esd per iec 61000 C 4 C 2 (air ) vpp 15 kv esd per iec 61000 C 4 C 2 (contact ) vpp 8 kv operating junction temperature t j -55 ~ 125 storage temperature range t stg -55 ~ 150 lead soldering temperature t l 260 ( 10sec ) electrical characteristics (t a =25 unless otherwise noted) parameter symbol conditions min. typ max. unit reverse stand C off voltage v rwm 5 v forward voltage @ if v f i f = 10ma 0.4 0.8 1.5 v reverse breakdown voltage v br it = 1ma 6.0 7.0 v reverse leakage current i r v rwm = 5v , t=25 0.01 1 a clamping voltage v c ipp = 1a , tp = 8/20 s 12 v junction capacitance cj v r = 0v, f = 1mhz any i/o pin to ground 0.7 1.0 pf v r = 0v, f = 1mhz between i/o pins 0.35
2012/ 10 /29 ver.2 page 3 sp e6 v8ud ultra low capacitance 4 -line esd protection array typical characteristics
2012/ 10 /29 ver.2 page 4 sp e6 v8ud ultra low capacitance 4 -line esd protection array schematic & pin configuration as figure shown is an example of how to route the h igh speed differential traces through the spe6v8ud. the solid line represents the pcb trace. the pcb traces are used to connect the pin pairs for each line (p in 1 to pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). fo r example, line 1 enters at pin 1 and exits at pin 10 and the pcb trace connects pin 1 and 10 together. this is true for lines connected at pins2, 4, and 5 also. ground is connected at pins3 and 8. one large ground pad should be used in lieu of two separate pads. application information ( design recommendations for hdmi protection ) adding external esd protection to hdmi ports can be challenging. first, esd protection devices have an inherent junction capacitance. however, adding even a small amount of capacitance will cause the impedance of t he differential pair to drop. second , large packages and land pattern requirements cause discontinuities that adversely affect signal integrity. the spe6v8ud and is specif ically designed for protection of high-speed interf aces such as hdmi. they present <0.4pf capacitance between the p airs while being rated to handle +/-8kv esd contact discharges (15kvair discharge) as outlined in iec61 000-4-2. each device is in a leadless dfn package t hat is less than 1.1mm wide. they are designed such that the tr aces flow straight through the device. the narrow p ackage and flow-through design reduces discontinuities and min imizes impact on signal integrity. this becomes eve n more critical as signal speeds increase. flow through layout using spe6v8ud
2012/ 10 /29 ver.2 page 5 sp e6 v8ud ultra low capacitance 4 -line esd protection array dfn-10 package outline
2012/ 10 /29 ver.2 page 6 sp e6 v8ud ultra low capacitance 4 -line esd protection array information provided is alleged to be exact and con sistent. sync power corporation presumes no respon sibility for the penalties of use of such information or for any vio lation of patents or other rights of third parties which may result from its use. no license is granted by allegation or otherwise un der any patent or patent rights of sync power corpo ration. conditions mentioned in this publication are subject to change without notice. this publication surpasses and re places all information previously supplied. sync power corporation produc ts are not authorized for use as critical component s in life support devices or systems without express written approval of sync power corporation. ?the sync power logo is a registered trademark of s ync power corporation ?2004 sync power corporation C printed in taiwan C all rights reserved sync power corporation 7f-2, no.3-1, park street nankang district (nksp), taipei, taiwan, 115, r.o.c phone: 886-2-2655-8178 fax: 886-2-2655-8468 ?http://www.syncpower.com
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